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Electrical Characteristics
2.3
Default Output Driver Characteristics
Table 4 provides information on the characteristics of the output driver strengths.
Table 4. Output Drive Impedance
DDR signal
DDR2 signal
Driver Type
Output Impedance ( Ω )
18
18
35 (half strength mode)
2.4
Thermal Characteristics
Table 5 describes thermal characteristics of the MSC8144 for the FC-PBGA packages.
Table 5. Thermal Characteristics for the MSC8144
Characteristic
Symbol
FC-PBGA
29 × 29 mm 5
Natural
200 ft/min
Convection
(1 m/s) airflow
Unit
Junction-to-ambient 1, 2
Junction-to-ambient, four-layer board 1, 3
R θ JA
R θ JA
20
15
15
12
°C/W
°C/W
Junction-to-board (bottom)
Junction-to-case 5
4
R θ JB
R θ JC
7
0.8
°C/W
°C/W
Notes:
28
1.
2.
3.
4.
5.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method (MIL
SPEC-883 Method 1012.1) with the calculated case temperature.
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 16
Freescale Semiconductor
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